Method of repairing damaged film having low dielectric constant, semiconductor device fabricating system and storage medium

ABSTRACT

A damaged layer repairing method repairs a damaged layer formed in a surface of a SiOCH film having a low dielectric constant film, containing silicon, carbon, oxygen and hydrogen and formed on a substrate through the elimination of carbon atoms by the decarbonizing effect of plasmas used in an etching process and an ashing process. CH 3  radicals are produced through the thermal decomposition of C 8 H 18 O 2  gas represented by a structural formula: (CH 3 ) 3 COOH(CH 3 ) 3 . CH 3  radicals are brought into contact with the damaged layer in the SiOCH film and are made to bond to the damaged layer to repair the damaged layer.

FIELD OF THE INVENTION

The present invention relates to a technique using plasma for repairing a decarbonized and damaged layer in a low-dielectric-constant film and containing silicon, carbon, oxygen and hydrogen.

BACKGROUND ART

There is a growing tendency for the scale of integration of semiconductor devices to increase every year. Resist materials and exposure techniques have been progressively improved to deal with the progressive miniaturization of patterns formed on a substrate, such as a semiconductor wafer (hereinafter, referred to as “wafer”), and the dimensions of apertures formed in resist masks have been remarkably decreased.

On the other hand, multiple-layer device structures have been developed to achieve the increased scale of integration. The parasitic capacitances of the semiconductor device need to be reduced to improve the circuit speed. Therefore, efforts have been made to develop materials having a low dielectric constant for forming insulating films, such as layer insulating films. An example of such a low-dielectric-constant film is a SiOCH film, which is generally called a porous MSQ film having Si—C bonds (Methyl-hydrogen-silses-quioxane film).

The SiOCH film, in which, for example, copper lines are embedded, is etched with plasma produced by ionizing CF₄ gas through a resist mask and a hard mask that are used as masks for etching, and subsequently, the resist mask is subjected to ashing (an ashing process) using plasma produced by ionizing oxygen gas. FIG. 14 is a typical view illustrating the processing, in which 100 is a SiOCH film, 101 is a resist mask and 102 is a hard mask.

By the way, when the SiOCH film 100 is subjected to a plasma process such as etching or ashing, for example, Si—C bonds in an exposed layer, that is, the sidewalls and the bottom wall of a recess of the SiOCH film 100 exposed to plasma, are broken Si—C bond and C atoms are eliminated from the film. Since Si atoms having unsaturated bond C called dangling bonds, formed through an elimination of C atoms are unstable, the atoms and moisture contained in the atmosphere bond together to produce Si—OH bonds.

Thus, the plasma process forms a damaged layer 103 on the exposed surface layer of the SiOCH film 100. Since the damaged layer 103 has a low carbon content, it has a low dielectric constant. The width of lines forming a wiring pattern and the thickness of wiring layers and insulating films have been progressively reduced. Therefore, the influence of the surface relative to that of the whole of a water W has been more significant, and even the reduction in the dielectric constant of the surface can be one of factors that cause the characteristics of a semiconductor device to differ from design values.

On the other hand, as a method of solving such a problem, there is known a technique disclosed in Patent Document 1. With this technique, a modification is made on the surface of the damaged layer containing OH groups produced by dry etching, using a silazane compound having Si—Si bonds and Si—CH₃ bonds. However, this technique is a surface modification method that replaces the hydrogen atoms of the OH groups with the above-mentioned silazane compound and does not restore the damaged layer to its original state before the plasma process. Therefore, the dielectric constant is different from a design value. Since the molecules of the above-described silazane compound are large, in addition, molecules formed on the surface of the film by replacing the hydrogen atoms with the silazane compound cause steric hindrance, molecules cannot penetrate deep into the film and hence the interior of the film cannot be modified.

[Patent document 1] Japanese Patent Laid-Open No. 2005-340288 (Paragraphs [0010] and [0028])

DISCLOSURE OF THE INVENTION

Problems to be Solved by the Invention

The present invention has been made under such circumstances, and it is therefore an object thereof to provide a technique of repairing a damaged layer, from which carbon atoms have been eliminated with a process using plasma, formed on a substrate on which an insulating film that consists of a low-dielectric-constant film containing silicon, carbon, oxygen and hydrogen is layered.

Means for Solving the Problems

A damaged layer-repairing method in a low-dielectric-constant film according to the present invention comprises:

a CH₃ radical-producing process by supplying energy to a CH₃ radical forming gas; and

a repairing process for supplying a low-dielectric-constant film with the CH₃ radicals, which contains silicon, carbon, oxygen and hydrogen and has a damaged layer from which carbon atoms have been eliminated, and bonding the CH₃ radicals to the said damaged layer.

The CH₃ radical-producing process is the thermal decomposition process of the CH₃ radical forming gas.

A damaged layer formable process in which the damaged layer is formed with the low-dielectric-constant film being damaged is a process in which the low-dielectric-constant film is exposed to plasma.

The process in which the low-dielectric-constant film is exposed to plasma is an etching process for forming a recess in the low-dielectric-constant film and/or an ashing process for ashing a resist film consisting of an organic film formed on top of the low-dielectric-constant film.

A workpiece on which the low-dielectric-constant film is formed is held in a vacuum atmosphere throughout a damaged layer formable process in which a damaged layer is formed in the low-dielectric-constant film being damaged and the repairing process.

The damaged layer formable process and the repairing process are carried out in the same processing vessel.

The CH₃ radical forming gas is a gas selected from di-t-alkyl peroxide((CH₃)₃COOC(CH₃)₃), methane(CH₄), azomethane((CH₃)₂N₂ and (CH₃)₃N), 2,2′-azobis isobutylnitrile((CH₃)₂C(CN)N═N(CN)C(CH₃)₂), dimethylamine((C₁-₃)₂NH) and neopentane(C(CH₃)₄).

A semiconductor device-fabricating system according to the present invention comprises:

a processing vessel;

a stage placed in the processing vessel to support a workpiece thereon;

a means for evacuating the said processing vessel; and

a means for producing CH₃ radicals by supplying energy to a CH₃ radical forming gas and supplying the CH₃ radicals to the workpiece supported on the said stage;

wherein a damaged layer, from which carbon atoms have been eliminated, formed in a low-dielectric-constant film that is formed on said workpiece and containing silicon, carbon, oxygen and hydrogen, is repaired by bonding CH₃ thereto.

The means for supplying the CH₃ radicals to the workpiece is a means for subjecting the CH₃ radical forming gas to thermal decomposition.

The means for supplying the CH₃ radicals to the workpiece is provided with a supply opening through which a gas containing the CH₃ radicals is supplied sideways to the workpiece.

The means for supplying the CH₃ radicals to the workpiece is provided with a gas supply device disposed opposite to the stage to supply a CH₃ radical forming gas.

The semiconductor device fabricating system according to the present invention further comprises:

a means for supplying a plasma treating gas into the said processing vessel; and

a means for generating plasma from the plasma treating gas in the said processing vessel;

wherein the workpiece is processed with a plasma-processing process using the plasma, and then a damaged layer damaged by the plasma-processing process in the low-dielectric-constant film is repaired.

The semiconductor device fabricating system according to the present invention further comprises:

a plasma-processing vessel separate from the said processing vessel;

a means for supplying a plasma treating gas into the plasma-processing vessel;

a means for generating plasma from the plasma treating gas in the said plasma-processing vessel;

a transfer chamber, allegedly in a vacuum atmosphere, connected to a damaged layer-repairing vessel and the plasma-processing vessel; and

a carrying means placed in the transfer chamber for carrying the workpiece between the plasma-processing vessel and the damaged layer-repairing vessel;

wherein the workpiece is subjected to plasma processing using a plasma, and then a damaged layer damaged by the plasma processing in a low-dielectric-constant film is repaired.

The plasma processing is an etching process for forming a recess in the low-dielectric-constant film and/or an ashing process for ashing a resist film consisting of an organic film formed on top of the low-dielectric-constant film.

A storage medium according to the present invention,

stores a computer program used for a device for repairing a damaged layer formed on a workpiece, from which carbon atoms have been eliminated in the low-dielectric-constant film containing silicon, carbon, oxygen and hydrogen;

wherein the said computer program includes step groups to be executed said damaged layer-repairing method.

EFFECT OF THE INVENTION

The present invention can repair a damaged layer damaged by decarbonization of a low-dielectric-constant film containing silicon, carbon, oxygen and hydrogen by supplying CH₃ radicals to the layer to bond carbon atoms thereto to suppress the deterioration in quality of the film. In addition, CH₃ radicals can penetrate into the depth of, for example, a porous film to repair the film. Furthermore, since CH₃ radicals have a long lifetime, the damaged layer can be repaired in a high intrasurface uniformity to the substrate.

Best Mode to Implement the Invention

Next, an example of a device for carrying out a repairing method in the present invention will be described with reference to FIGS. 1 and 2. The device is configured such that a function able to repair a SiOCH film is added to a plasma-processing system 2 that is able to carry out etching and ashing to a substrate. The plasma-processing system 2 shown in FIG. 1 includes a processing vessel 21, such as a plasma-processing vessel whose inside is a sealed vacuum chamber, a stage 3 disposed on a central part of the bottom wall of the processing vessel 21, and an upper electrode 4 disposed above the stage 3 opposite to the said stage 3.

The said processing vessel 21 is electrically grounded. An evacuating unit 23, which is a vacuum evacuation means, is placed in an exhaust pipe 24 connected to an exhaust port 22 formed in the bottom surface of the processing vessel 21. A pressure adjusting unit, not shown, is connected to the evacuating unit 23. The pressure-adjusting unit is configured so as to maintain the interior space of the processing vessel 21 at a desired vacuum with signals given thereto by a controller 2A that will be described later. An opening 25 of a wafer W is formed in the sidewall of the processing vessel 21. The opening 25 can be opened and closed with a gate valve 26.

A heater block is attached to the inside wall of the processing vessel 21 and is configured to maintain the inside wall of the processing vessel 21 at a high temperature, for example, 60° C. or above, to prevent the deposition of fluorocarbon or the like. However, the description of the heater block will be omitted here.

The stage 3 includes a lower electrode 31 and a support member 32 supporting the lower electrode 21 thereon, and is mounted on an insulating member 33 placed on the bottom surface of the processing vessel 21. An electrostatic chuck 34 is placed on top of the stage 3. The electrostatic chuck 34 holds the wafer W on the stage 3. The electrostatic chuck 34, which is composed of an insulating material, is internally provided with an electrode foil 36 that is connected to a high-voltage DC power source 35. The high-voltage DC power source 35 applies a voltage to the electrode foil 36 to generate static electricity on the surface of the electrostatic chuck 34. The wafer W mounted on the stage 3 is configured to be held by the electrostatic attraction of the electrostatic chuck 34. The electrostatic chuck 34 is provided with through holes 34 a to spout a backside gas, described later, to the upper part of the electrostatic chuck 34.

The stage 3 is internally provided with a coolant passage 37, through which a predetermined coolant (for example, a conventionally-known fluorine-contained fluid or water) is passed. The coolant is passed through the coolant passage 37 to cool the stage 3 so that the wafer W supported on the stage 3 is configured to be cooled at a desired temperature. Further, a temperature sensor, not shown, is attached to the lower electrode 31 to continuously monitor the temperature of the wafer W placed on the lower electrode 31.

In addition, the stage 3 is internally provided with a gas passage 38 that supplies a heat-conducting gas, such as He (helium) gas, as a backside gas. The gas passage 38 opens at a plurality of positions in the upper surface of the stage 3. The openings are communicated to the said through holes 34 a provided on the electrostatic chuck 34. When the gas passage 38 is supplied with a backside gas, the backside gas is spouted to the upper part of the electrostatic chuck 34 through the through holes 34 a. The spouted backside gas diffuses uniformly in the whole space between the electrostatic chuck 34 and the wafer W held on the electrostatic chuck 34 to enhance heat conduction in the space.

The said lower electrode 31 is grounded through a high-pass filter (HPF) 3 a. A high-frequency power source 31 a is connected through a matching device 31 b to the lower electrode 31 to supply power of a second high frequency of, for example, 2 MHz.

A focusing ring 39 is placed on a peripheral part of the lower electrode 31 so as to surround the electrostatic chuck 34. When plasma is produced, the focusing ring 39 is configured to concentrate the plasma on the wafer W held on the stage 3.

The upper electrode 4 is formed as a hollow structure serving as a gas shower head, which has a bottom wall provided with many spouting holes 41 formed in a uniform arrangement, for examoke, so that a process gas disperses in the processing vessel 21. Further, a gas supply pipe 42 is connected to a central part of the upper surface of the upper electrode 4. The gas supply pipe 42 penetrates the central part of the upper surface of the processing vessel 21 through an insulating member 27. Then, four branch pipes 42A to 42D branch out from an upstream part of the gas supply pipe 42 and are connected through valves 43A to 43D and flow controllers 44A to 44D to gas sources 45A to 45D. A gas supply pipe 42E, described later, is connected trough a valve 43E and a flow controller 44E to a gas source 45E.

The valves 43A to 43E and the flow controllers 44A to 44E constitute a gas supply system 46. Supply of the gases from the respective gas sources 45A to 45E and the flow rates of the gases can be controlled with control signals given by the controller 2A that will be described later. Further, the branch pipes 42A to 42D, the gas supply system 46 and the respective gas sources 45A to 45D constitute a plasma source gas supply system.

The upper electrode 4 is grounded through a low-pass filter (LPF) 47. Further, a high-frequency power source 4 a is connected through a matching device 4 b to the upper electrode 4 to supply power of a first high frequency of, for example, 60 MHz, which is higher than a second high frequency power source 31 a, thereto.

A high-frequency wave generated by the high-frequency power source 4 a connected to the upper electrode 4 is equivalent to a first high-frequency wave used for ionizing the plasma process gas. A high-frequency wave generated by the high-frequency power source 31 a connected to the lower electrode 31 is equivalent to a second high-frequency wave used for supplying a bias power to the wafer W to attract ions of plasma to the surface of the wafer W. The upper electrode 4 and the lower electrode 31 constitute a system for ionizing a plasma treating gas. The high-frequency power sources 4 a and 31 a are connected to the controller 2A to control the magnitudes of power to be supplied to the upper electrode 4 and the lower electrode 31.

In addition, a gas-heating device 63 is attached to the sidewall of the processing vessel 21 to supply a CH₃ radical forming gas to the wafer W. As shown in FIG. 3, for example, the gas-heating device 63 has a cylindrical case 64 and is connected to the processing vessel 21 and a gas supply pipe 42E so that the gas flows from the right side to the left side in the drawing. A supply port 67 is provided between the processing vessel 21 and the gas-heating device 63 to supply the gas containing CH₃ radicals to a workpiece. A heating element 65, for example, a tungsten filament capable of heating the gas at, for example, 1000° C. is provided, in the gas heating device 63, as a heating coil along a flow channel of the gas. A power source 66 is connected to the heating element 65 through the case 64. The gas supplied from the above-mentioned gas source 45E through the gas supply pipe 42E into the heating device 63 is decomposed by the heating element 65 into radicals that are to be supplied into the processing vessel 21. The gas heating device 63, the gas supply pipe 42E, the gas supply system 46 and the gas source 45E constitute a system for supplying CH₃ radicals to a workpiece. The case 64 is provided with, for example, a quartz window, not shown. The temperature of the heating element 65 may be measured with a radiation thermometer, not shown, from outside the case, and the temperature of the heating element 65 may be controlled.

The controller 2A of the plasma-processing system 2 is, for example, a computer. The controller 2A includes a data-processing unit having a program, a memory and a CPU. The said program has such instructions that the controller 2A gives control signals to each the components of the plasma-processing system 2 and executes respective steps of a plasma process, which will be described later, to process the wafer W. In addition, the memory, for example, has areas holding values of process parameters including process pressure, processing time, a gas flow rate and an electric power value. The CPU reads the values of those process parameters to execute the respective instructions of the program. Then, control signals representing the values of those parameters are given to the respective components of the plasma-processing system 2. The program (including a program specifying operations for entering the process parameters and displaying information) is stored in a storage device 2B, namely, a computer-oriented storage medium, such as a flexible disk, a compact disk, an MO disk (magnetooptical disk) or a hard disk (HD), and is installed in the controller 2A.

Next, a semiconductor device-fabricating method in a preferred embodiment according to the present invention using the said plasma-processing system 2 will be described. First, the gate valve 26 is opened, a 300 mm diameter (12 in. diameter) wafer W is carried into the processing vessel 21 by a carrying mechanism, not shown. The wafer W is placed horizontally on the stage 3 and the wafer W is held fixedly on the stage 3 by electrostatic attraction. Subsequently, the carrying mechanism is retracted from the processing chamber 21, and then the gate valve 26 is closed. Subsequently, the backside gas is supplied through the gas passage 38 to adjust the temperature of the wafer W to a predetermined one. Then, the following steps are executed.

Here, FIG. 4(a) shows a structure formed on a surface of the wafer W. In this example, copper wiring lines are formed with a dual damascene process. In the drawing, 56 is a Cu wiring line, 53 is a SiC film serving as an etch stopper, 54 is a SiOCH film serving as a layer insulating film, 59 is a SiO₂ film serving as a hard mask, 51 is a resist mask, and 55 is an aperture.

(Step 1: Etching Process)

The evacuating unit 23 evacuates the inside of the processing vessel 21 through the exhaust pipe 24 and maintains the processing vessel 21 at a predetermined vacuum and then, the gas supply system 46 supplies, for example, C₄F₈ gas, nitrogen gas (N₂) and Ar gas thereinto. Subsequently, a first high-frequency wave of, for example, 60 MHz of frequency, and 1200 W of electric power is supplied to the upper electrode 4, and plasma of the process gas is generated therefrom, namely, a mixed gas of the above-mentioned gases. A second high-frequency wave of, for example 2 MHz in frequency and 1200 W in electric power is supplied to the lower electrode 31.

The plasma contains active species of a compound of carbon and fluoride. When the SiO₂ film 59 and the SiOCH film 54 are exposed to the active species, a compound is produced as a result of a reaction with atoms in the film. Thus, the SiO₂ film 59, the SiOCH film 54 and the SiC film 53 are etched and a recess 57 is formed as shown in FIG. 3(b).

At this time, a damaged layer 60 is formed with C atoms eliminated on the sidewalls of the recess 57 formed in the SiOCH film 54 as a result of exposure to the plasma as described above.

(Step 2: Ashing Process)

Next, power supply from the high-frequency power sources 4 a and 31 a is stopped to stop producing plasma in the processing vessel 21, and then the gas supply system 46 stops supplying the gases. Subsequently, the evacuating unit 23 evacuates the inside of the processing vessel 21 and holds a predetermined vacuum in the processing vessel 21.

The gas supply system 46 supplies, for example, O₂ gas, and plasma is generated from the said gas by supplying a first high-frequency wave of, for example, 60 MHz of frequency and 300 W of electric power to the upper electrode 4, and a second high-frequency wave of, for example, 2 MHz in frequency and 300 W in electric power is supplied to the lower electrode 31.

The resist mask 51 is subjected to ashing and removed by the plasma as shown in FIG. 3(c).

It is expected that the thickness of the damaged layer 60 increases when the damaged layer 60 formed in the above etching process is exposed to the plasma during the above-described ashing process.

(Step 3: Repairing Process)

The gas supply system 46 stops supplying the gas into the processing vessel 21 after the high-frequency power sources 4 a and 31 a have stopped supplying power to stop producing the plasma therein. Then, the evacuating unit 23 evacuates the processing vessel 21 and keeps the inside of the processing vessel 21 at a predetermined vacuum between 1 Pa (7.5 mTorr) and 10 Pa (75 mTorr), for example. Meanwhile, the power source 66 supplies power to the heating element 65, namely, a tungsten filament, of the gas-heating device 63 to hold the heating element at 1000° C.

The gas source 45E supplies a CH₃ radical forming gas, namely, C₈H₁₈O₂ gas [di-t-alkyl peroxide gas (represented by a structural formula: (CH₃)₃COOH(CH₃)₃)], through the gas supply pipe 42E to the gas-heating device 63. The gas is decomposed by heat that is generated by the heating element 65. The C₈H₁₈O₂ gas is converted into CH₃ radicals by thermolysis, with a reaction mechanism expressed by Expressions (1) and (2), and the radicals are supplied into the processing vessel 21. C₈H₁₈O₂→2(CH₃)₃CO   (1) (CH₃)₃CO→(CH₃)₂CO+CH₃   (2)

This state is kept for a time of, for example, 20 min. Consequently, the damaged layer 60 formed in the SiOCH film 54 by the plasma in the etching process and the ashing process is repaired as shown in FIG. 4(d). This reaction is expressed by Expressions (3) and (4). SiO⁻+—CH₃→SiOCH₃   (3) SiO₂+—CH₃→SiOCH₃+O⁻  (4)

A symbol “CH₃” indicates a CH₃ radical. Further, drawings in FIG. 5 show this reaction mechanism. As shown in FIG. 5(a), the plasma used in the etching process and the ashing process destroys Si—C bonds on a surface of the SiOCH film 54, thereby producing unsaturated bonds called dangling bonds. The dangling bonds are produced also in the SiOCH film 54, and the depth thereof (film thickness of the damaged layer 60) is greater when the amount of the plasma to which the SiOCH film 54 is exposed is larger. Usually, the dangling bonds and moisture contained in the atmosphere, to be described later, bond together to produce Si—OH bonds.

When CH₃ radicals are supplied to the dangling bonds, Si—CH₃ bonds are produced as shown in FIG. 5(b). In addition, since the SiOCH film 54 is a porous film, CH₃ radicals having small molecules can penetrate deep into the SiOCH film 54. In this case, the CH₃ groups bonded to the surface of the above SiOCH film 54 are small and hence scarcely cause steric hindrance to CH₃ radicals that are going to penetrate into the inside of the SiOCH film 54. Therefore, CH₃ radicals can penetrate deep into the SiOCH film 54 and can bond to the inside dangling bonds to produce Si—CH₃ bonds after the Si—CH₃ bonds have been formed on the surface of the SiOCH film 54. Thus the damaged layer 60 can be repaired.

On the other hand, each of atoms of a CH₃ radical is arranged in the same plane and hence a deposit is scarcely formed on the SiOCH film 54. Therefore, the radicals can selectively bond to the dangling bonds.

Further, since CH₃ radicals do not react with other compounds produced with the decomposition of C₈H₁₈O₂ or repaired dangling bonds, the damaged layer formed on the surface of the wafer W can be repaired in a high intrasurface uniformity even if the CH₃ radicals are unevenly supplied to the wafer W because the wafer W is held for a long time in the processing vessel 21 as obvious from examples to be described later.

Although a single supply port of the CH₃ radicals is provided on the sidewall of the processing vessel 21 in this example, a plurality of supply ports may be arranged in a circumferential arrangement on the side wall of the processing vessel 21. In this case, it is expected that the damaged layer 60 can be repaired in a still higher intrasurface uniformity. Since radicals can be supplied at a higher supply rate with such a configuration, the damaged layer 60 can be quickly repaired. Further, a plurality of exhaust ports 22 may be formed in a circumferential direction of the wafer W to improve the intrasurface uniformity of the wafer W.

It is expected that compounds other than, the CH₃ radicals produced in Expressions (1) and (2) are discharged from the exhaust ports 22 without acting on the SiOCH film 54 due to a low reaction provability with the SiOCH film 54.

Any suitable gas that selectively produces CH₃ radicals, and produces a small amount of CH, CH₂ and C, which have large attachment coefficients with the SiOCH film 54 and the like, may be used instead of C₈H₁₈O₂ gas for producing CH₃ radicals that is used in this embodiment. Possible CH₃ radical source gases are, for example, methane(CH₄), azomethanes((CH₃)₂N₂) and (CH₃)₃N), 2,2′-azobis iso-butylnitrile((CH₃)₂C(CN)N═N(CN)C(CH₃)₂), dimethylamine((CH₃)₂NH), and neopentane(C(CH₃)₄. Although the gas is decomposed in this embodiment with thermal decomposition using heat generated by the heating element 65 such as a tungsten filament in order to generate CH₃ radicals, other decomposition processes that produce only a small amount of CH, CH₂ and C, and selectively produce CH₃, such as a catalytic CVD process, can also be used.

In addition, after the SiOCH film 54 has been thus repaired, for example, the recess 57 is filled up with an organic film as a sacrificial film, and Cu is embedded in the organic film formed in the recess 57 to build a wiring structure.

In the foregoing embodiment, the SiOCH film 54 is processed with etching and ashing as plasma-processing processes, and then the damage layer 60 in the SiOCH film 54 produced by the plasma processing is repaired with the repairing process using CH₃ radicals. The composition of elements of the repaired SiOCH film 54 can be made similar to that of the SiOCH film 54 before the plasma processing. Thus, the reduction in the dielectric constant of the SiOCH film 54 can be suppressed. Consequently, a semiconductor device having expected electrical characteristics can be fabricated.

As will be obvious from the following experiments, the repairing process can repair sidewalls of recesses, such as grooves, formed on a surface of a wafer W and can repair those of grooves having a narrow width on the order of 180 nm.

The repairing process using CH₃ radicals does not exert a bad effect on other films, the characteristics of the semiconductor device and the plasma-processing system 2. Therefore, the repairing process for repairing the damaged layer 60 in the SiOCH film 54 can be continued till a semiconductor device has electrical characteristics at a desired level.

Further, the plasma-processing system 2 in the present invention can accomplish the process for etching the SiOCH film 54, the ashing process and the repairing process in the same processing vessel 21 without taking the wafer W from and returning the same into the processing vessel 21 by changing process conditions including process gases and process pressures. Therefore, the repairing process can be accomplished without an OH group-removing process being carried out after the plasma-processing process by suppressing the bonding of OH groups to the dangling bonds of Si atoms. Thus, the plasma-processing system is advantageous in throughput and installation space. The repairing process may be executed after the completion of both of the etching process and the ashing process but may also be executed after the completion of each of the etching process and the ashing process.

The wafer W subjected to the plasma-processing process in the present invention may be provided with the resist mask 51 formed contiguously on an insulating film, such as the SiOCH film 54, or may be provided with an antireflection film to prevent a reflection at the time of an exposure, for example, which is formed between a hard mask, such as the SiO₂ film 59, formed on the insulating film, such as the SiOCH film 54, and the resist mask 51.

The repair in the present invention is applicable not only to repairing the damaged layer 60 in the SiOCH film 54, but also to repairing a damaged layer of a film containing Si, O, C and H and subject to the elimination of C atoms when exposed to light like plasma or a radiation, such as an MSQ film (methyl-hydrogen-silses-quixane film) or an HSQ film (hydrogen-silses-quioxane film).

Further, an organic film formed on a film, such as a layer-insulating film provided with recesses formed by etching, and removed by an ashing process can be modified using CH₃ radicals to obtain an organic film highly resistant to plasma used in an etching process.

In addition, the present invention is not limited in its application only to the SiOCH film 54 processed by etching and ashing. For example, the present invention may be applied to an after-treatment process for processing the SiOCH film 54 damaged by removing a layer deposited on the SiOCH film 54.

The method of producing CH₃ radicals used in the present invention may be used thermal decomposition of not only C₈H₁₈O₂ gas but also the above-mentioned gases having CH₃ groups, or used not only thermal decomposition but also light energy or the like.

The plasma-processing system 2 used in the present invention may be to supply the first high-frequency wave for ionizing the plasma process gas to the lower electrode 31 instead of the upper electrode 4. In other words, a device having a structure of the so-called lower two frequencies may be adopted.

In this embodiment, the gas-heating device 63 is disposed outside the processing vessel 21. The device may also be configured such that the CH₃ radical forming gas is supplied into the processing vessel 21, the heating element 65 is provided inside the processing vessel 21, and CH₃ radicals are produced inside the processing vessel 21.

Here, in this embodiment, the plasma processing system 2 is provided with the gas-heating device 63 and is configured to carry out both the radical process and the plasma process in the same processing vessel 21. Each of the processes may also be carried out in separate processing vessels. FIG. 6 shows an example of such a configuration. In FIG. 6, 70 indicates a semiconductor device-fabricating system called a cluster tool or multichamber for carrying out the radical process and the plasma process; 71 and 72 are carrier holding units provided with gate doors GT for holding a carrier C that is a container for containing wafers W for carrying from the atmosphere side; 73 is a first transfer chamber; 74 and 75 are spare vacuum chambers; and 76 is a second transfer chamber. These units and chambers have air-tight structures isolated from the atmosphere and can be made to produce a vacuum atmosphere or an inert atmosphere. 77 is a first carrying device, and 78 is a second carrying device for carrying a workpiece between a processing vessel for carrying out the plasma process and a processing vessel for carrying out a damaged layer-repairing process. In addition, a plasma-processing unit 80 and a radial-processing unit 81 for repairing the damaged layer 60 formed with the plasma process using radicals are connected in an air-tight fashion to the second transfer chamber 76. The plasma-processing unit 80 includes a processing vessel, not shown, for the plasma process in the inside thereof and a gas supply pipe, not shown, is connected thereto, which is a means to supply plasma-processing gas. Further, a pair of high-frequency electrodes, not shown, are placed in the processing vessel, which are a means to ionize a plasma process gas supplied through the gas supply pipe to produce plasma. Here, it is also possible to provide a processing unit as 82 like the plasma-processing unit 80 or the radical-processing unit 81.

In the semiconductor device fabricating system 70 shown in FIG. 6, for example, the first carrying device 77 carries the wafer W from the carrier C to the spare vacuum chamber 74 (or 75) and then to the plasma-processing unit 80 through the second carrying device 78. The plasma processes, such as the etching process and the ashing process, are carried out as mentioned before. Then, the second carrying device 78 carries the wafer W to the radical-processing unit 81. Thus, the above-described repairing process is conducted. The bonding of OH groups and the like to the dangling bonds of Si atoms can be suppressed by creating a vacuum atmosphere created in the second transfer chamber 76 during those operations. Although it is preferable to create a vacuum atmosphere in the second transfer chamber 76, another atmosphere like an inert atmosphere of a gas not containing O, such as Ar or N₂, may be created therein.

Here, the radical-processing unit 81 for repairing the wafer W will be briefly described with reference to FIG. 7. Referring to FIG. 7(a), 82 is a processing vessel for repairing a damaged layer, which has a vacuum chamber. A stage 83, a heating element 84 and a gas supply device 85 for supplying a CH₃ radical forming gas are disposed inside the processing vessel 82. An opening 82 a and a gate valve 82 b are formed in the sidewall of the processing vessel 82 so that the wafer W is transferred between the stage 83 and the above-described second carrying device 78. An outlet 82 c is formed at the bottom of the processing vessel 82, and an exhaust device 90 that carries out vacuum evacuation can evacuate the inside of the processing vessel 82 through the exhaust pipe 89. Further, the stage 83 has a temperature sensor, not shown, and a mechanism for cooling the wafer W embedded and is configured to control the temperature of the wafer W. The gas supply device 85 is provided with a plurality of small pores 86 and is configured such that a gas supplied from a gas source 88 through a gas supply pipe 87 thereto is discharged uniformly toward the stage 83. The heating element 84, such as a tungsten filament, is disposed between the gas supply device 85 and the stage 83 and, as shown in FIG. 7(b), is connected to a power source, not shown, installed outside the processing vessel 82 and supplies the wafer W with the gas supplied from the gas source 85 after its thermal decomposition. Therefore, the heating element is formed, for example, in a zigzag shape having a large contact area with the gas.

The wafer W carried by the above-mentioned second carrying device 78 through the opening 82 a of the processing vessel 82 onto the stage 83 is held on the stage 83 with an electrostatic chuck incorporated into the above-described stage 83. Then, pressure inside the processing vessel 82 is controlled so as to be at a predetermined vacuum by the exhaust device 90 through the exhaust pipe 89. The gas source 88 supplies a radical forming gas, such as C₈H₁₈O₂ gas, through the gas supply pipe 87 into the processing vessel 82. Then, the gas passes through the heating element 84 heated beforehand at, for example, 1000° C., is subjected to thermal decomposition with this heat to produce mainly CH₃ radicals, and is supplied to the wafer W. As mentioned before, a damaged layer 60 is repaired on the wafer W. After the repairing process is continued for a predetermined time, the wafer W is carried with a returning procedure reverse to a feeding procedure by which the wafer W is carried to the processing vessel to carry away the wafer from the radical-processing unit 81 and the semiconductor device-fabricating system 70.

The plasma-processing unit 80 thus constructed can process the wafer W in a shorter time and improve the productivity of the system. Further, since the radicals are supplied from the top of the wafer W in a highly uniformity to the wafer W, the surface of the wafer W can be repaired in an intrasurface uniformity.

This embodiment shows a configuration to produce CH₃ radicals in the processing vessel 82 in which the damaged layer 60 is subjected to the repairing process but is not limited to this configuration. A separate gas-decomposing unit may be provided outside the processing vessel 82 with the heating element 84 provided therein to produce the radicals through the thermal decomposition of the CH₃ radical forming gas and supply them into the processing vessel 82.

EXAMPLES

Next, experiments conducted to verify the effects of the present invention will be described. Each of the experiments used the plasma-processing system 2 shown in FIG. 1 for conducting plasma processing to the wafer W. In addition, the system is configirated so that a QMS (quadrupole mass spectrometer) was held on the sidewall of the processing vessel 21 to analyze the types of radicals flowing in the processing vessel 21.

(Experiment 1: Determination of the Correlation Between a Processing Time and the Amount of Repair in the Repairing Process)

Test wafers W were prepared by coating surfaces of 8 in. (200 mm)-diameter bear silicon wafers entirely with a SiOCH film 54 as shown in FIG. 8(a). The test wafers were subjected to a plasma process under the following process conditions to form a damaged layer 60 thereon. Further, the plasma process was supposed to be the etching process executed in Step 1 or the ashing process executed in Step 2 as described before.

(Plasma Process)

Frequency of wave of upper electrode 4: 60 MHz

Power supplied to the upper electrode 4: 300 W

Frequency of wave of lower electrode 31: 2 MHz

Power supplied to the lower electrode 31: 0 W

Process pressure: 1.3 Pa (9.75 mtorr)

Process gas: O₂ (300 sccm)

Processing time: 10 sec

Next, the wafers W processed by the above plasma process were subjected to a repairing process under the following process conditions.

(Repairing Process)

Process gas: C₈H₁₈O₂ gas=300 sccm

Process pressure: 5.3 Pa (39.75 mtorr)

Temperature of the heating element 65: 1000° C.

Processing times were set in eight ways: 1, 3, 5, 7, 9, 15 and 25 min.

In addition, samples that were not subjected to the repairing process were prepared as a reference example after the above-mentioned plasma process had been conducted.

Results of Experiments

The wafers W were taken out from the processing vessel 21 into the atmosphere and the following matters thereof were measured in a predetermined experimental device after the above-described processes had been carried out for the respective wafers W. First, the thickness D of the damaged layer 60 shown in FIG. 8(a) was measured by a spectroscopic ellipsometer, and the measured data are shown in FIG. 9(a). The surface of the SiOCH film 54 was analyzed by an XPS (X-ray photoelectron spectroscopy) to determine the respective amounts of elements in the surface. The calculated ratios of the respective amounts of C atoms and O atoms to that of Si atoms are shown in FIG. 9(b). Similar data on the wafers W before having been subjected to the plasma process is shown also in (b) of the same drawing.

In addition, since this experiment intended to measure not only the surface but also the interior of the damaged layer 60, a measuring apparatus capable of measuring through a depth not smaller than the thickness of the damaged layer 60 was used. In other words the repair by CH₃ radicals starts from the surface of the SiOCH film 54 and spreads thereinto. Therefore, a measuring apparatus capable of measuring the whole thickness of the damaged layer 60 in a nondestructive measuring mode was used. However, the symbol D in FIG. 8(a) indicates the thickness from the surface of the SiOCH film 54.

As obvious from FIG. 9(a), it has been found that the thickness D of the damaged layer 60 decreases with the processing time of the repairing process is prolonged. When the duration of the repairing process was 25 min, the depth of the repaired part from the surface of the SiOCH film 54 was found to be about 20 nm. It is expected from a linear approximate curve obtained through a calculation using the results of the experiments that the thickness D of the damaged layer 60 decreases to zero in about 50 min and the damaged layer is repaired completely in a state before the plasma process.

As shown in FIG. 9(b), the ratio of C is reduced with the plasma process (refer to zero processing time). Therefore, as mentioned above, it is conjectured that the damaged layer 60 was formed through the elimination of C atoms from the SiOCH film 54. Further, since the ratio of O increases, it is conjectured that, as mentioned above, OH groups and the like contained in the atmosphere bond to the dangling bonds of the C atoms eliminated.

The amounts of C and O atoms approach those before the plasma process with the progress of the repairing process. However, whereas the ratio of O considerably approaches the value before the plasma process with the 25-minute process, the ratio of C is only ⅔ of that before the plasma process. It is conjectured that the dangling bonds of Si atoms once bonded to OH groups and the like have the OH groups and the like eliminated by CH₃ radicals and subsequently bonded to the CH₃ radicals, thereby causing a time lag between the elimination of the OH groups and the like and the bonding of the CH₃ radicals.

Further, it is conjectured from the inclinations of the curves shown in FIGS. 9(a) and (b) that the CH₃ radicals repair the surface of the SiOCH film 54 in an initial period of about 15 min of the repairing process and subsequently repair the inner part of the SiOCH film 54. In other words, since the inclinations of the curves are gentle in the initial period of about 15 min and subsequently become sharp, it is conjectured that the radicals diffuse in the surface of the wafer W first and then diffused into the interior thereof.

(Experiment 2: Uniformity of the Degree of Repair in the Plane of the Wafer W)

Next, each process was carried out with the following process conditions.

Example 2

Plasma processes and a repairing process were carried out with the same conditions as those for Experiment 1, except the process condition shown below.

(Repairing Process)

Processing time: 18 min

Reference Example 2

The plasma process was carried out with the same conditions as those for Experiment 1. The repairing process was not conducted.

Results of Experiment

With regard to the wafer W after being processed, respective thicknesses D of five parts in the damaged layer 60 were measured on the X-axis and Y-axis of the wafer W by the spectroscopic ellipsometer in the same manner as in Experiment 1. Here, the supply port through which CH₃ radicals were supplied was directed toward the center of the wafer W. A line connecting the supply port and the center of the wafer W is aligned with the Y-axis, and the X-axis is perpendicular to the Y-axis.

FIG. 10(b) shows the measured data. In addition, the respective thicknesses on the X-axis and Y-axis of the damaged layer 60 in the reference example were substantially equal and hence the data thereon is shown by being simplified. As a result, it was found that the repairing process repaired the damage layer 60 to about 25 nm substantially uniformly over the entire surface of the wafer W.

The intrasurface degree of repair of the wafer W was somewhat irregular on the Y-axis. However, the differences in the degree were as small as 10% or below, and it is good result. Thus, it is considered that the CH₃ radicals were supplied uniformly over the surface of the wafer W. Those facts prove that, as described above, the CH₃ radicals bond selectively to the dangling bonds of Si atoms and scarcely react with other compounds and the CH₃ radicals remain unreacted for a long time so as to diffuse uniformly in the processing vessel 21.

It is conjectured that the irregularity of the degree of repair on the Y-axis is caused by the connecting position of the gas-heating device 63 on the processing vessel 21. In other words, exhaust is made from the same direction as that of the side in which the gas-heating device 63 is provided with respect to the wafer W. Thus, it is conjectured that the amount of the CH₃ radicals on the side opposite the side of the gas heating device 63 and the exhaust port 22 with respect to the wafer W is small and the CH₃ radicals segregate with respect to the Y-axis. As mentioned above, it is expected that such an irregularity can be easily improved by changing the positions and numbers of the gas heating devices 63 and the exhaust ports 22 and further, the intrasurface uniformity of the degree of repair in the wafer W can be improved.

(Experiment 3: Degree of Repair on the Line Width of a Pattern)

Subsequently, a resist mask consisting of an organic film was deposited on top of the wafer W shown in FIG. 8(a), and an opening of a width L1 was formed on the resist mask. Then, the wafer W was processed with an etching process and an ashing process under the following process conditions to form a recess 57 of a width L1 as shown in FIG. 8(b). Then, the wafer W not processed by a repairing process was also prepared with the etching process and the ashing process as shown below as a reference example. Values of the width L1 were formed by setting respectively for the examples and the comparative examples.

(Etching Process)

Frequency of wave of upper electrode 4: 60 MHz

Power supplied to the upper electrode 4: 1200 W

Frequency of wave of lower electrode 31: 2 MHz

Power supplied to the lower electrode 31: 1200 W

Process pressure: 10 Pa (75 mTorr)

Process gas: C₄F₈/N₂/Ar=4/150/1000 sccm

Processing time: 90 sec

(Ashing Process)

Frequency of wave of upper electrode 4: 60 MHz

Power supplied to the upper electrode 4: 300 W

Frequency of wave of lower electrode 31: 2 MHz

Power supplied to the lower electrode 31: 300 W

Process pressure: 1.3 Pa (10 mTorr)

Process gas: O₂=300 sccm

Processing time: 45 sec

(Repairing Process)

Process gas: C₈H₁₈O₂ gas=300 sccm

Process pressure: 5.3 Pa (39.75 mTorr)

Temperature of the heating element 65: 1000° C.

Processing time: 0 min

Example 3-1

L1: 180 nm

Example 3-2

L1: 200 nm

Example 3-3

L1: 250 nm

Reference Example 3-1

L1: 180 nm. Not repaired.

Reference Example 3-2

L1: 200 nm. Not repaired.

Reference Example 3-3

L1: 250 nm. Not repaired.

Results of Experiments

Each of the wafers W thus processed was immersed in a 1% by weight HF solution for 30 sec. The width L2 of the recess 57 including the damaged layer 60 on the sidewall thereof was measured, and a change L (L=L2−L1) in the line width including the damaged layer 60 was shown in FIG. 11. In other words, whereas the damaged layer 60 formed in the SiOCH film 54 from which carbon atoms are eliminated from the surface thereof dissolves in the HF solution, the SiOCH film 54 from which the carbon atoms are not eliminated does not dissolve in the HF solution. Therefore, the thickness of the damaged layer 60 can be known by its immersion in the HF solution.

As a result, the experiment showed that CH₃ radicals were able to act on the sidewalls of the recess 57 and repair the damaged layer 60 even when the width L1 was as narrow as 180 nm. On the other hand, it was found that the L of the damaged layer 60 in the HF solution was smaller when the width L1 in the recess 57 was narrower. Such a result is conjectured to be due to a condition that the sidewalls of the recess 57 having a smaller width are exposed to the plasma for a shorter time in the etching process and the ashing process.

In addition, the smaller the width L1 is, the greater the difference is between the L after the ashing and that after the repairing process. This proves that the thickness of the damaged layer 60 repaired with the repairing process is greater as the width L1 is narrower. Such a result is conjectured to be due to a condition that the sidewalls of the recess 57 having a smaller width are exposed to the plasma for a shorter time in the etching process and the ashing process.

(Experiment 4: Analysis of Radical Species)

The composition of the radicals supplied into the processing vessel 21 was measured with the above-mentioned QMS (quadrupole mass spectrometer). Process conditions were the same as those for the repairing process in Experiment 1. Measured results are shown in FIG. 12.

Results of Experiment

As shown in FIG. 12, CH₃, C₃H₆O and C₄H₉O were produced in the processing vessel 21 through the thermal decomposition of the C₈H₁₈O₂ gas. Peaks of CO and C₃H₆ were unable to be identified. Therefore, peaks of CO and C₃H₆ were estimated on the basis of mass number and compounds that were possibly produced. As mentioned above, CH, CH₂, C and the like having large attachment coefficients were not produced and CH₃ radicals were produced through the thermal decomposition of the C₈H₁₈O₂ gas. It is conjectured that compounds other than the CH₃ radicals did not act on the wafer W and were discharged through the exhaust port 22.

(Experiment 5: Variation of the Amount of CH₃ Radicals with Time)

The amount of CH₃ radicals supplied into the processing vessel 21 was measured by a QMS (quadrupole mass spectrometer) similar to that used in Experiment 4. In this experiment, in order to examine the variation of the amount of the CH₃ radicals on time for which power was supplied to the heating element 65, C₈H₁₈O₂ gas was supplied into the processing vessel 21 before power was supplied to the heating element 65 in the repairing process mentioned in Experiment 1. Subsequently, the supply of power to the heating element 65 was started to confirm the variation of the amount of the CH₃ radicals with time. The result is shown in FIG. 13.

Results of Experiment

The amount of the CH₃ radicals slightly increased immediately after power had started to be supplied to the heating element 65 and then began sharply increasing. It was considered that the rate of the increase in the amount was proportional to the temperature of the heating element 65. The temperature of the heating element 65 stabilized in about 30 sec after power had started to be supplied to the heating element 65. It could confirmed that the CH₃ radicals were produced through the thermal decomposition of C₈H₁₈O₂ gas.

BRIEF DESCRIPTION OF THE DRAWINGS

[FIG. 1 ]

A longitudinal sectional view of a plasma-processing system in a preferred embodiment according to the present invention.

[FIG. 2]

A cross-sectional view of a plasma-processing system in a preferred embodiment according to the present invention.

[FIG. 3]

A schematic view of a CH₃ radical-producing device used in the present invention.

[FIG. 4]

Views of a structure of a wafer W used in steps of plasma processes used in the present invention and each plasma process.

[FIG. 5]

Diagrammatic views thought to illustrate an example of a reaction mechanism to be carried out in a repairing step used in the present invention.

[FIG. 6]

A diagrammatic view of a semiconductor device-fabricating system in a preferred embodiment according to the present invention.

[FIG. 7]

Schematic views showing an example of a radical-processing device used in the present invention.

[FIG. 8]

Schematic views of the wafer W supplied in steps of an experiment.

[FIG. 9]

Graphs showing results of Experiment 1 in the present invention.

[FIG. 10]

Graphs showing results of Experiment 2 in the present invention.

[FIG. 11]

Graphs showing results of Experiment 3 in the present invention.

[FIG. 12]

Graphs showing results of Experiment 4 in the present invention.

[FIG. 13]

Graphs showing results of Experiment 5 in the present invention.

[FIG. 14]

Pattern diagrams of the wafer W in a known plasma-processing process.

DESCRIPTIONS OF NUMERICAL SYMBOLS

-   2 Plasma-processing system -   21 Processing vessel -   3 Stage -   31 Lower electrode -   4 Upper electrode -   54 SiOCH film -   57 Recess -   60 Damaged layer -   63 Gas-heating device -   80 Plasma-processing unit -   81 Radical-processing unit 

1. A damaged layer repairing method of repairing a damaged layer in a low-dielectric-constant film, said damaged layer repairing method comprising: a CH₃ radical producing process for producing CH₃ radicals by supplying energy to a CH₃ radical source gas; and a repairing process for repairing a damaged layer, from which carbon atoms have been eliminated, formed in a low-dielectric-constant film containing silicon, carbon, oxygen and hydrogen by supplying the CH₃ radicals with the low-dielectric-constant film and bonding the CH₃ radicals to the damaged layer.
 2. The damaged layer repairing method of repairing a damaged layer in a low-dielectric-constant film according to claim 1, wherein the CH₃ radical producing process produces CH₃ radicals through the thermal decomposition of the CH₃ radical source gas.
 3. The damaged layer repairing method of repairing a damaged layer in a low-dielectric-constant film according to claim 1, wherein the damaged layer is formed by a damaged layer formable process in which the low-dielectric-constant film is exposed to a plasma.
 4. The damaged layer repairing method of repairing a damaged layer in a low-dielectric-constant film according to claim 2, wherein the damaged layer is formed by a damaged layer formable process in which the low-dielectric-constant film is exposed to a plasma.
 5. The damaged layer repairing method of repairing a damaged layer in a low-dielectric-constant film according to claim 3, wherein the damaged layer formable process in which the low-dielectric-constant film is exposed to a plasma is an etching process for forming a recess in the low-dielec-tric-constant film and/or an ashing process for ashing an organic resist film formed on the low-dielectric-constant film.
 6. The damaged layer repairing method of repairing a damaged layer in a low-dielectric-constant film according to claim 4, wherein the damaged layer formable process in which the low-dielectric-constant film is exposed to a plasma is an etching process for forming a recess in the low-dielec-tric-constant film and/or an ashing process for ashing an organic resist film formed on the low-dielectric-constant film.
 7. The damaged layer repairing method of repairing a damaged layer in a low-dielectric-constant film according to claim 1, wherein a workpiece on which the low-dielec-tric-constant film is formed is held in a vacuum atmosphere throughout a damaged layer formable process in which a damaged layer is formed in the low-dielectric-constant film and the repairing process.
 8. The damaged layer repairing method of repairing a damaged layer in a low-dielectric-constant film according to claim 2, wherein a workpiece on which the low-dielec-tric-constant film is formed is held in a vacuum atmosphere throughout a damaged layer formable process in which a damaged layer is formed in the low-dielectric-constant film and the repairing process.
 9. The damaged layer repairing method of repairing a damaged layer in a low-dielectric-constant film according to claim 1, wherein the damaged layer formable process and the repairing process are carried out in a single processing vessel.
 10. The damaged layer repairing method of repairing a damaged layer in a low-dielectric-constant film according to claim 2, wherein the damaged layer formable process and the repairing process are carried out in a single processing vessel.
 11. The damaged layer repairing method of repairing a damaged layer in a low-dielectric-constant film according to claim 1, wherein the CH₃ radical source gas is any one of gases of di-t-alkyl peroxide((CH₃)₃COOC(CH₃)₃), methane(CH₄), azomethane((CH₃)₂N₂ and (CH₃)₃N), 2,2′-azobis isobutylnitrile((CH₃)₂C(CN)N═N(CN)C(CH₃)₂), dimethylamine((CH₃)₂NH) and neopentane(C(CH₃)₄).
 12. The damaged layer repairing method of repairing a damaged layer in a low-dielectric-constant film according to claim 2, wherein the CH₃ radical source gas is any one of gases of di-t-alkyl peroxide((CH₃)₃COOC(CH₃)₃), methane(CH₄), azomethane((CH₃)₂N₂ and (CH₃)₃N), 2,2′-azobis isobutyinitrile((CH₃)₂C(CN)N═N(CN)C(CH₃)₂), dimethylamine((CH₃)₂NH) and neopentane(C(CH₃)₄).
 13. A semiconductor device fabricating system comprising: a processing vessel; a stage placed in the processing vessel to support a workpiece thereon; an evacuating means for evacuating the processing vessel; and a CH₃ radial supplying means for producing CH₃ radicals by supplying energy to a CH₃ radical source gas and supplying CH₃ radicals to the workpiece supported on the stage; wherein a damaged layer, from which carbon atoms have been eliminated, formed in a low-dielectric-constant film formed on the workpiece and containing silicon, carbon, oxygen and hydrogen is repaired by bonding CH₃ radicals to the damaged layer.
 14. The semiconductor device fabricating system according to claim 13, wherein the CH₃ radical supplying means produces CH₃ radicals through the thermal decomposition of the CH₃ radical source gas.
 15. The semiconductor device fabricating system according to claim 13, wherein the CH₃ radical supplying means is provided with a supply opening through which a gas containing CH₃ radicals is supplied sideways to the workpiece.
 16. The semiconductor device fabricating system according to claim 13, wherein the CH₃ radical supplying means for supplying CH₃ radicals to the workpiece is provided with a gas supply device disposed opposite to the stage to supply a CH₃ radical source gas.
 17. The semiconductor device fabricating system according to claim 13 further comprising: a plasma source gas supplying means for supplying a plasma source gas into the processing vessel; and a plasma generating means for generating a plasma from the plasma source gas; wherein the workpiece is processed by a plasma-processing process using the plasma, and then a damaged layer damaged by the plasma-processing process using the plasma in the low-dielectric-constant film is repaired.
 18. The semiconductor device fabricating system according to claim 13 further comprising: a plasma-processing vessel separate from the processing vessel; a plasma source gas supplying means for supplying a plasma source gas into the plasma-processing vessel; a plasma generating means for generating a plasma from the plasma source gas in the plasma-processing vessel; a vacuum transfer chamber connected to a damaged layer repairing vessel and the plasma-processing vessel; and a carrying means placed in the transfer chamber and capable of moving between the plasma-processing vessel and the damaged layer repairing vessel to carry the workpiece between the plasma-processing vessel and the damaged layer repairing vessel; wherein the workpiece is subjected to a process using a plasma, and then a damaged layer damaged by the process using the plasma in a low-dielectric-constant film is repaired.
 19. The semiconductor device fabricating system according to claim 17, wherein the plasma-processing process in which the low-dielectric-constant film is exposed to a plasma is an etching process for forming a recess in the low-dielec-tric-constant film and/or an ashing process for ashing an organic resist film formed on the low-dielectric-constant film.
 20. The semiconductor device fabricating system according to claim 13, wherein the CH₃ radical source gas is any one of gases of di-t-alkyl peroxide((CH₃)₃COOC(CH₃)₃), methane(CH₄), azomethane((CH₃)₂N₂ and (CH₃)₃N), 2,2′-azobis isobutylnitrile((CH₃)₂C(CN)N═N(CN)C(CH₃)₂), dimethylamine((CH₃)₂NH) and neopentane(C(CH₃)₄).
 21. A storage medium storing a computer program for controlling a repairing system for repairing a damaged layer, formed in a low-dielectric-constant film containing silicon, carbon, oxygen and hydrogen, through elimination of carbon atoms from a surface layer of the low-dielectric-constant film; wherein the computer program includes instructions to be executed to accomplish the steps of the damaged layer repairing method of repairing a damaged layer in a low-dielectric-constant film according to claim
 1. 